DISCO DAS 6IL
DICING SAW, 6X12" CUTTING AREAIDEAL FOR CUTTING HARD MATERIALS

DISCO MICROSCOPE
BINOCULAR, FOR DISCO DICING SAW

DYNATEX Z740
LUBRICANT INJECTOR FOR WAFER SAW

DYNATEX Z760
WAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6" PRIOR TO DICING, SCRIBING

Esec 8003
The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuck table by means of vacuum and the chuck can accommodate circular and rectangular wafers in a range from 1" to 6". The maximum table stroke...

K&S 382

K&S 775-4
6" COMPUTER CONTROLLED HIGH POWER DICING SAW, W/VIDEO MANGETIC CHUCK, CAN BE CONVERTED TO VAC CHUCK

KARL SUSS RA120M
120mm X 120mm TRAVEL
SCRIBE RANGE WITH SKIP IS 3X3"
SMALLEST STEPS: X=5 MICRONS, Y=1 MICRON (5 MICRON ACCURACY OVER 3")

LOOMIS LCD2P
SEMIAUTOMATIC SCRIBER WITH BREAK OPTION

LOOMIS MKT 33
SEMIAUTOMATIC SCRIBER

MICROAUTOMATION 1006
6"" DICING SAW, AVAILABLE WITH MICROSCOPE OR VIDEO CAMERA.

Microautomation 2006
MICROAUTOMATION 2006 SCRUBBER, UP TO 6" WAFERS
BRUSH CLEAN, MICROPROCESSOR CONTROLLED
SERVICED AND TESTED BY FACTORY TRAINED TECHNICIAN

MICROAUTOMATION 602M
4" AIR BEARING DICING SAW, MICROPROCESSOR CONTROLLED

REBUILT MICROAUTOMATION 1100
Completely Rebuilt 200mm dicing saw. This saw is capable of cutting 8" wafers (200mm) on film frames. It is offered by JM Industries (25 years in the semiconductor industry) All new PLC controls, color touch screen, digital camera, 8" diameter chuck with frame extensions 1 year warranty....

PHILTEC 2015
PHILTEC WAFER GROOVER/SECTIONER

TEMPRESS 1713
SEMIAUTOMATIC SCRIBER

Tempress 2
auto indexing, includes microscope

TEMPRESS 602
4" AIR BEARING DICING SAW, INCLUDES MICROSCOPE

TEMPRESS 602
Tempress 602 dicing saw for up to 3" wafers. automatic indexing, manual theta includes microscope and air reservoir tank

TEMPRESS 602
3" AIR BEARING DICING SAW, INCLUDES MICROSCOPE

TSK 2500
6" WAFER DICING SAW WITH OPTICS AND HIGH POWER SPINDLE