HYBOND 522A THERMOSONIC BALL BONDER
The Model 522A sets the industry standard for ease of operation and maintenance.
Front panel operator controls include force, ultrasonic time, ultrasonic energy,
tail length, EFO power, and stage heat. The 4:1 X-Y manipulator stage movement
and Z axis bond motion are conveniently located to reduce operator fatigue.
Precision machined mechanical components with sealed ball bearings at major
points are durable and trouble free. Modular electronics facilitate quick
and cost effective maintenance.
HYBOND Soft TouchTM energy system.
Front panel ultrasonic test button.
Deep vertical access of 0.59 inch.
1-2-2 stitch capability standard.
Horizontal reach of 3.5 inches.
2 inch spool mount.
Loop height control adjustment.
Electronic ball size control.
Independent Z lever for control
of bonding tool.
Motorized vertical wire feed
Wire-in-tool bonds within 0.04 inch from backwall.
Independent control of first and second bond
Tail length is adjustable in .003 inch increments
by a front panel control.
Audio and visual bond sequence fault indicators.
6 x 8.5 inch work plate supports various heated
LED readout for setting and monitoring work stage
Infinite angle mounting for microscope
Please note: JMI has thousands of machines in stock and the photo of the item taken at our facility is for reference. There may be multiple models of this item in stock. JMI will email a video of any machine purchased under payment terms agreed, demonstrating operation (prior to shipment) at your request.
JMI has been selling refurbished semiconductor manufacturing equipment for over 40 years. Experienced technicians and a vast inventory of machines and parts enables JMI to offer support on the majority of tools we sell….for many years after the Original equipment manufacturer (OEM) does not.
Many tools are also listed on ebay if you prefer to purchase online immediately.
To avoid Ebay commissions, you can also place most machines on hold immediately by calling or texting J on his cell phone (978) 771-0481.