HYBOND 616 ULTRASONIC PEG BONDER
HYBOND’s Model 616 ultrasonic single channel peg bonder has
been designed to perform ultrasonic attachment of insulated or
bare wire/ribbon. Applications include hard disk head stack
assemblies, head gimbal assemblies, microwave and
Bond level sensor system which stops Z
movement at bonding level and activates bond force/ultrasonics sequence.
Front panel control of bond head search height
which indexes from last bonding level.
Bond head vertical movement controlled by
push button or electrical foot actuation (manual or automatic).
Electrical chassis with modular circuit boards
for control functions to allow simplified
trouble shooting and repair.
HYBOND standard work platform with 4:1
Force system factory adjusted to prevent
Anti-static equipment enclosure.
Please note: JMI has thousands of machines in stock and the photo of the item taken at our facility is for reference. There may be multiple models of this item in stock. JMI will email a video of any machine purchased under payment terms agreed, demonstrating operation (prior to shipment) at your request.
JMI has been selling refurbished semiconductor manufacturing equipment for over 40 years. Experienced technicians and a vast inventory of machines and parts enables JMI to offer support on the majority of tools we sell….for many years after the Original equipment manufacturer (OEM) does not.
Many tools are also listed on ebay if you prefer to purchase online immediately.
To avoid Ebay commissions, you can also place most machines on hold immediately by calling or texting J on his cell phone (978) 771-0481.