Click Here to see a demonstration of the Westbond 7200A Wire Bonder
Epoxy dispense and chip pickup tool are
grouped into one tool assembly which is
motor and cam driven to oscillate into use
position. Machine senses either epoxy
dispense or chip pickup through relative
position of the patented single-lever X-Y-Z
FEATURES AVAILABLE WITH WESTBOND 7200A BONDER
Inert Atmosphere for heated workholders: Preforms, packages subject to oxidation.
Hexacollet Turret (unheated): Preforms, hybrids, pick and place.
Large X-Y Platform, with ball race: Small devices requiring less than 1″ x 1″ gross motion.
Free Furnace with Die Presentation,
complete with Temperature Controller: Preforms and devices requiring heat.
2″x 2″ Fluoroware Support (Wafflepack): Alternate to random die presentation.
Please note: JMI has thousands of machines in stock and the photo of the item taken at our facility is for reference. There may be multiple models of this item in stock. JMI will email a video of any machine purchased under payment terms agreed, demonstrating operation (prior to shipment) at your request.
JMI has been selling refurbished semiconductor manufacturing equipment for over 40 years. Experienced technicians and a vast inventory of machines and parts enables JMI to offer support on the majority of tools we sell….for many years after the Original equipment manufacturer (OEM) does not.
Many tools are also listed on ebay if you prefer to purchase online immediately.
To avoid Ebay commissions, you can also place most machines on hold immediately by calling or texting J on his cell phone (978) 771-0481.