WESTBOND THERMOCOMPRESSION WIRE BONDER
Bonds fine wires in the range of .5 mil (12 microns) to 2 mil (50 microns)
by the popular thermocompression technique. This machine is the
standard in the industry for bonding extremely small geometries
and particularly GASFET devices. Operator has finite control of
the bonding tool down to the last instant of positioning
over the bond targets.
Please note: JMI has thousands of machines in stock and the photo of the item taken at our facility is for reference. There may be multiple models of this item in stock. JMI will email a video of any machine purchased under payment terms agreed, demonstrating operation (prior to shipment) at your request.
JMI has been selling refurbished semiconductor manufacturing equipment for over 40 years. Experienced technicians and a vast inventory of machines and parts enables JMI to offer support on the majority of tools we sell….for many years after the Original equipment manufacturer (OEM) does not.
Many tools are also listed on ebay if you prefer to purchase online immediately.
To avoid Ebay commissions, you can also place most machines on hold immediately by calling or texting J on his cell phone (978) 771-0481.