The MEI 827 hybrid ball bonder is a simple yet very efficient semi-automatic bonder for thermosonic or thermocompression bonding. Unique gravity fed/damper controlled bonding arm ensures a constant controlled impact force. The patented wire feed system with EFO ensures constant ball size independent of bonding levels.The aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 60 lbs and the size is 12″ W X 18″D X 17 3/4″H.
JMI can offer full support on these machines when you purchase them here.
Please note: JMI has thousands of machines in stock and the photo of the item taken at our facility is for reference. There may be multiple models of this item in stock. JMI will email a video of any machine purchased under payment terms agreed, demonstrating operation (prior to shipment) at your request.
JMI has been selling refurbished semiconductor manufacturing equipment for over 40 years. Experienced technicians and a vast inventory of machines and parts enables JMI to offer support on the majority of tools we sell….for many years after the Original equipment manufacturer (OEM) does not.
Many tools are also listed on ebay if you prefer to purchase online immediately.
To avoid Ebay commissions, you can also place most machines on hold immediately by calling or texting J on his cell phone (978) 771-0481.