VERTICAL FEED, HEATED WORK HOLDERS AND
HEATED TRANSDUCER OPTIONS ARE AVAILABLE.
The Mei 202 bonder is a pull tester. (Email us for photo)
WITH 6:1 MICROPOSITIONER
INCLUDES: STEREO OPTICS, HEATED WORK HOLDER
HOT GAS OPTION, AND EXTRA LARGE POSITIONING STAGE
MEI 703/709 STANDARD FEATURES
Manual Z-lever control for die placement
Direct view of die placement, providing the highest level of...
The MEI 772 Hybrid Epoxy Die Mounter enables mounting of a wide variety
of chips required by complex hybrid circuits without tool change. Chips
such as capacitors, diodes, IC's and LED's may be assembled without
changing setup, tools or dispenser.
The MEI 779 is a manual pick and place system. (Email us for photo)
The MEI 827 hybrid ball bonder is a simple yet very efficient semi-automatic bonder for thermosonic or thermocompression bonding. Unique gravity fed/damper controlled bonding arm ensures a constant controlled impact force. The patented wire feed system with EFO ensures constant ball size...
The MEI 907 is a manual wedge bonder with Z lever and U.S. generator.
MEI 1204B SEMIAUTOMATIC BALL BONDER
INCLUDES STEREO ZOOM OPTICS
AND HEATED WORKHOLDER
MANUAL Z LEVER
(ALSO AVAILABLE UPGRADE TO B&L ZOOM 5 OPTICS, 8-40X)
The MEI 829 is a ball bonder with electronic flame off and heated workholder. (Email us for photo)
The MEl 829Z is a thermosonic ball bonder with manual Z lever and heated work holder.
The MEI 909 ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder. It is specifically useful for cerdips, side brazed packages and small hybrids. Unique gravity fed/damper controlled bonding arm ensures a uniform impact force. Two bonding levels can be preset. The user only...