DISCO DAD 2SP6T
DICING SAW
WITH SPLIT FIELD MICROSCOPE
6" CAPABILITY

Disco Dad 321 Dicing Saw
DICES UP TO 6" WAFERS
INCLUDES 6" POROUS FILM FRAME CHUCK
SMALL FOOT PRINT, HIGH POWER 1500 WATT SPINDLE

DISCO DAD 6IL
DICING SAW, 6X12" CUTTING AREAIDEAL FOR CUTTING HARD MATERIALS

DISCO MICROSCOPE
BINOCULAR, FOR DISCO DICING SAW

DAC-2SP/86
Automatic indexing dicing Saw. Substrates up to 150 mm. Indexes 0.0001 to 99.9999 mm. Min Step Index: 0.00025 mm. Spindle Rotation: 3000 to 40,000 rpm

DISCO DAD 2H/6T
DISCO DAD 2H/6T DICING SAW
SPLIT FIELD MICROSCOPE
6" CAPABLITY
HIGH POWER SPINDLE
MOTORIZED CHUCK ROTATION

DYNATEX Z740
LUBRICANT INJECTOR FOR WAFER SAW

DYNATEX Z760
WAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6" PRIOR TO DICING, SCRIBING

Esec 8003
The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuck table by means of vacuum and the chuck can accommodate circular and rectangular wafers in a range from 1" to 6". The maximum table stroke...

KARL SUSS RA120M
120mm X 120mm TRAVEL
SCRIBE RANGE WITH SKIP IS 3X3"
SMALLEST STEPS: X=5 MICRONS, Y=1 MICRON (5 MICRON ACCURACY OVER 3")

K&S 775-4
6" COMPUTER CONTROLLED HIGH POWER DICING SAW, W/VIDEO MANGETIC CHUCK, CAN BE CONVERTED TO VAC CHUCK

K&S 382
K&S 382 AUTO FILM FRAME MOUNTER (BONDER) INCLUDES QTY 25 6" FILM FRAMES

LOOMIS SCRIBER LCD 1
LOOMIS SCRIBER LCD 1 ( TEMPRESS SCRIBER COMPLETELY REBUILT BY LOOMIS) INCLUDES WAFER BREAKER OPTION (SCRIBES AND BREAKS UP TO 3" WAFERS) 5" RING FOR TAPE

Loomis LSD100 Scriber
*Roller-style breaker for up to 4" wafers
*Motorized rotation control
*Color camera

LOOMIS MKT 33
SEMIAUTOMATIC SCRIBER

LOOMIS SCRIBER LCD 2P
LOOMIS SCRIBER LCD 2P ( TEMPRESS SCRIBER COMPLETELY REBUILT BY LOOMIS) INCLUDES WAFER BREAKER OPTION (SCRIBES AND BREAKS UP TO 4" WAFERS)

Loomis LSD 100 Scriber
Loomis
LOOMIS LSD 100 SCRIBER
INCLUDES WAFER BREAKER OPTION
AUTOMATIC INDEXING
COMPUTER CONTROLLED, WINDOWS XP
(SCRIBES AND BREAKS UP TO 4" WAFERS)

MICROAUTOMATION 1006A
6"" DICING SAW, AVAILABLE WITH MICROSCOPE OR VIDEO CAMERA.

MICROAUTOMATION 1100
6" MICROPROCESSOR CONTROLLED DICING SAW WITH CCTV AND VIDEO CAMERA.

Microautomation 2006
MICROAUTOMATION 2006 SCRUBBER, UP TO 6" WAFERS
BRUSH CLEAN, MICROPROCESSOR CONTROLLED
SERVICED AND TESTED BY FACTORY TRAINED TECHNICIAN

MICROAUTOMATION 602M
4" AIR BEARING DICING SAW, MICROPROCESSOR CONTROLLED

REBUILT MICROAUTOMATION 1100
Completely Rebuilt 200mm dicing saw. This saw is capable of cutting 8" wafers (200mm) on film frames. It is offered by JM Industries (25 years in the semiconductor industry) All new PLC controls, color touch screen, digital camera, 8" diameter chuck with frame extensions 1 year warranty....

MICROAUTOMATION 1006A
MICROAUTOMATION 1006A WITH VIDEO CAMERA AND MONITOR, 6" CAPABILTY, AIR BEARING SPINDLE SERVICED BY FACTORY TRAINED TECHNICIAN. SAW CAN SHIP 2-3 WEEKS AFTER ORDER IS RECEIVED. (2) IN...

Philtec 2015
PHILTEC WAFER GROOVER/SECTIONER

TEMPRESS 1713
SEMIAUTOMATIC SCRIBER

Tempress 2
auto indexing, includes microscope

TEMPRESS 602
3" AIR BEARING DICING SAW, INCLUDES MICROSCOPE

TSK 2500
6" WAFER DICING SAW WITH OPTICS AND HIGH POWER SPINDLE

Viking 1010B
VIKING 1010B DIE EXPANDER