Hughes HDB 985
The Hughes HDB 985 is a semiautomatic epoxy die bonder. (Email us for photo)

Hughes HPB-360
HUGHES HPB360 PULSE HEAT WIRE BONDER (INCLUDES STEREO ZOOM OPTICS)

K&S 642
Kulicke and Soffa
The K&S 642 is an euctectic die bonder with heated workholder. Add $400 for multicollet spindle.

K&S 643
The K&S 643 makes it possible to
bond chips to hybrid packages without
the risk of causing previously bonded
adjacent chips to float loose or cooking
film resistors until they change value. The
technique is to heat only a chip-size spot of
the substrate...

K&S 648
The K&S 648 bonder is an eutectic die attacher.

Laurier Auto Die HA245+
The Laurier Auto Die HA245+ is a bonder, it picks from up to 6" diced wafer and bonds to packages with epoxy.

Laurier CP222
The Laurier CP222 is a manual pick and place machine.

Laurier PS 275
The Laurier PS 275 is an auto pick and place dual camera and monitor with RS232 and keyboard. (Email us for photo)

Laurier SA220
The Laurier SA220 is an epoxy die bonder (liquid transfer system).

Laurier SA202
The Laurier SA202 is an epoxy die bonder.

Mech-El 703/709
WITH 6:1 MICROPOSITIONER
INCLUDES: STEREO OPTICS, HEATED WORKHOLDER ,
HOT GAS OPTION, AND EXTRA LARGE POSITIONING STAGE


Mech-El 703/709 STANDARD FEATURES

Manual Z-lever control for die placement
Direct view of die placement, providing the highest...

Mech-El 779
The Mechel 779 is a manual pick and place system. (Email us for photo)

Mech-El 772
The Mech-El 772 Hybrid Epoxy Die Mounter enables mounting of a wide variety of chips required by complex hybrid circuits without tool change. Chips such as capacitors, diodes, IC's and LED's may be assembled without changing setup, tools or dispenser. MECHEL 772 EPOXY DIE BONDER INCLUDES...

MEI 703/709
WITH 6:1 MICROPOSITIONER
INCLUDES: STEREO OPTICS, HEATED WORK HOLDER
HOT GAS OPTION, AND EXTRA LARGE POSITIONING STAGE

MEI 703/709 STANDARD FEATURES
Manual Z-lever control for die placement
Direct view of die placement, providing the highest level of...

MEI 772
The MEI 772 Hybrid Epoxy Die Mounter enables mounting of a wide variety
of chips required by complex hybrid circuits without tool change. Chips
such as capacitors, diodes, IC's and LED's may be assembled without
changing setup, tools or dispenser.

FEATURES ...

MEI 779
The MEI 779 is a manual pick and place system. (Email us for photo)

SEC 4000
The SEC 4000 is an eutectic die bonder with heated workholder and heated bond tool.

SEC 4400
The SSEC 4400 is a hot gas rework station with non heated workholder (Email us for photo)

SEC 4500
The SEC 4500 has a reworked hot gas station w/non heated stage (Email us for photo)

Tempress 1100/ Unitek 32
The Tempress 1100/Unitek 32 is a thermocompression die bonder with heated work holder. (Email us for photo)

Westbond 7200
The Westbond 7200 is an epoxy die bonder. This is a small footprint version. (Email us for photo)

Westbond 7200c
West Bond
Westbond 7200c epoxy die bonder, LCD display

Westbond 7316C Eutectic Die Bonder
Westbond 7316C Eutectic Die bonder
LCD display