Laurier Auto Die HA245+
The Laurier Auto Die HA245+ is a bonder, it picks from up to 6" diced wafer and bonds to packages with epoxy.

LAURIER CP222
manual pick and place system

Laurier CP222
The Laurier CP222 is a manual pick and place machine.

LAURIER DS6000
high speed pick and place system, for up to 6'' wafers on film frames. Dual camera, loads waffle pack

Laurier PS 275
The Laurier PS 275 is an auto pick and place dual camera and monitor with RS232 and keyboard. (Email us for photo)

Laurier SA220
The Laurier SA220 is an epoxy die bonder (liquid transfer system).

LAURIER SA202
LAURIER SA202
MANUAL PICK AND PLACE SYSTEM
WITH EPOXY DISPENSER
INCLUDES VIDEO SYSTEM
AND XY MICROMETER STAGE FOR FINE PLACEMENT.

Laurier SA202
The Laurier SA202 is an epoxy die bonder.