auto pick and place ds 275 dual camera and monitor w/rs232 and keybd
Laurier Auto Die HA245+
The Laurier Auto Die HA245+ is a bonder, it picks from up to 6" diced wafer and bonds to packages with epoxy.
manual pick and place system
The Laurier CP222 is a manual pick and place machine.
high speed pick and place system, for up to 6'' wafers on film frames. Dual camera, loads waffle pack
Laurier PS 275
The Laurier PS 275 is an auto pick and place dual camera and monitor with RS232 and keyboard. (Email us for photo)
The Laurier SA220 is an epoxy die bonder (liquid transfer system).
The Laurier SA202 is an epoxy die bonder.